BGA Soldering and Inspection

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] video about his techniques for soldering BGA and inspecting that you managed to do it right.

He’s got quite a few tips about things like surface finish and flux selection. It looks easy when he does it. Of course, having a good PCB with good registration markings will help too.

You can’t get a soldering iron under the part, of course. A hot plate provides heat from underneath. A gentle push from a hot air gun will push the solder balls over the melting edge. Even taking the part off the hotplate requires a special technique.

Without seeing the result, how can you know if it was successful? Pros can use an X-ray machine, but you probably don’t have one of those sitting in your shop. [VoltLog] uses a DVM and tests the internal protection diodes that the chip almost certainly has on its pins. However, to do that, you need to put the chip on a bare board. If you were repairing an existing board, the technique wouldn’t be useful since other components on the board would throw the measurements off.

We’ve seen the very patient hand solder wires to BGAs. You can also find more detailed videos and compare other techniques if you want to try them yourself.